Due to their inherent specifications, today’s products are often based on various, mostly different physical phenomena, and are at the same time exposed to various physical effects. Often, the results of individual effects interact, thus preventing the impact from being observed separately. By using the appropriate software, we combine the relevant processes for predicting valid results, e.g. in the thermal management of electrical and electronic components, in coupled heat-transfer processes or fluid-structure-interaction.
Based on these results, we numerically analyze these complex – often coupled - multi-physics systems and obtain realistic results and statements taking into account the relevant interactions.
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